Clarkson University

Temporary Research Assistant – Chemical Mechanical Polishing

Location US-NY-Potsdam
ID 2026-1364
Position Type
Grant Funded
Remote
No
Visa Sponsorship Eligible
No
Hybrid Role
No

Pay Range

USD $20.00 - USD $20.00 /Hr.

Overview

Clarkson University seeks a Temporary Research Assistant to support an industry-sponsored research project in tungsten chemical mechanical polishing (CMP). The position will involve CMP experimentation, slurry formulation and evaluation, electrochemical characterization, surface metrology, defectivity analysis, quantitative data analysis, and technical reporting.

 

Candidates with research experience in CMP, electrochemical methods, semiconductor materials processing, surface and interface characterization, or surface metrology are strongly preferred. Experience correlating CMP process parameters with material removal, surface quality, and defectivity is particularly desirable.

 

Responsibilities

• Conduct laboratory experiments related to chemical mechanical polishing and surface processing.
• Prepare experimental formulations and samples.
• Perform electrochemical measurements and analysis.
• Conduct materials and surface characterization.
• Analyze and interpret experimental data.
• Maintain accurate laboratory records and document research results.
• Prepare scientific figures, technical reports, presentations, and research manuscripts.
• Assist with other research activities related to the sponsored project.

Qualifications

Minimum Qualifications
• Ph.D. in Physics, Materials Science and Engineering, Chemical Engineering, or a closely related field.
• Research experience in chemical mechanical polishing, semiconductor materials processing, materials characterization, electrochemistry, surface science, or a related area.
• Experience with laboratory experimentation and quantitative data analysis.
• Strong scientific writing, data presentation, and communication skills.
• Ability to work independently and collaboratively in a research environment.

 

Preferred Qualifications
• Hands-on experience with chemical mechanical polishing (CMP).
• Experience with electrochemical methods and analysis.
• Experience with materials and surface characterization techniques.
• Experience with experimental design and quantitative analysis of research data.
• Record of peer-reviewed research publications.

Physical Demands

The physical demands characteristics described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

Health & Safety

Health & Safety: All staff has a statutory responsibility to take reasonable care of themselves, others and the environment and to prevent harm by their acts or omissions. All staff is therefore required to adhere to the University’s Health, Safety, and Environmental Policy & Procedures.

Disclaimer Statement

DISCLAIMER: The above statements are designed to indicate the general nature and level of work performed by employees assigned to this classification. They are not intended to be construed as an exhaustive list of all duties, responsibilities, skills, and qualifications required of personnel so classified.

EEO Statement

Special Instructions to Applicants: An equal opportunity/affirmative action employer, Clarkson actively seeks and encourages applications from veterans and people with disabilities. 

 

All offers of employment are subject to the applicant successfully passing a background check (including, but not limited to, employment verification, educational and other credential verification, and criminal records

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