This position will be responsible for working on the planarization of sophisticated interconnect structures, which are crucial for improving the performance and reliability of integrated circuits. In addition, the post-doctoral research will focus on the development and optimization of chemical mechanical planarization (CMP) and post-CMP cleaning techniques. A key component of the role involves performing detailed data analysis on CMP performance metrics such as removal rate, surface roughness, and defectivity to guide process optimization and validate experimental results.
General Purpose:
Synthesis of abrasive particles, surface modification, formulation of CMP slurry, and development of post-CMP cleaning solution on grant-funded research through multiple industries. The role also includes analyzing process data to assess trends, determine statistical significance of experimental findings, and generate models that support slurry formulation.
This is a partime position up to 25 hours per week.
Characterize the thin films and the associated CMP slurries using a number of experimental techniques, and analyze the resulting data to extract key performance indicators such as material removal rate, uniformity, surface roughness, and defect levels. Use statistical tools and data visualization to interpret trends and support process optimization.
Education:
Minimal Qualifications: A master in Chemical, Mechanical, Applied Data, and Materials engineering is required.
Experience:
Preferred Experience:
Proficient in analyzing CMP process data to evaluate material compatibility, removal efficiency, and defectivity across different integration schemes.
The physical demands characteristics described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.
Health & Safety: All staff has a statutory responsibility to take reasonable care of themselves, others and the environment and to prevent harm by their acts or omissions. All staff is therefore required to adhere to the University’s Health, Safety, and Environmental Policy & Procedures.
DISCLAIMER: The above statements are designed to indicate the general nature and level of work performed by employees assigned to this classification. They are not intended to be construed as an exhaustive list of all duties, responsibilities, skills, and qualifications required of personnel so classified.
Special Instructions to Applicants: An equal opportunity/affirmative action employer, Clarkson actively seeks and encourages applications from veterans and people with disabilities.
All offers of employment are subject to the applicant successfully passing a background check (including, but not limited to, employment verification, educational and other credential verification, and criminal records
Software Powered by iCIMS
www.icims.com